Anti-Splatter Protection: It prevents the formation of uneven solder balls and “bursting” caused by pad oxidation or stencil protrusion during heating.

High-Temperature Resistance: Made from ultra-clear, explosion-proof glass, it can withstand extreme heat without cracking, maintaining high thermal conductivity to ensure even heating of the chip.

Stencil Stability: It solves the issue of steel re-balling meshes bulging or deforming under heat, ensuring a flat surface for precise soldering.

Clear Visibility: The transparent glass allows technicians to monitor the soldering process in real-time while protecting the surrounding workspace.

Material: Impact-resistant and heat-resistant ultra-white glass.

Size: Standard units are typically around 20x20mm for precision soldering.

Durability: Designed to maintain its colour and adhesion under high-temperature soldering conditions without peeling.